Titanium Anode for PCB Copperizing:

Base Material: Titanium (Gr1, Gr2)

Shape: rod, strip, disc, plate, mesh, wire, tube or combinations and or assemblies of these materials. (customized)

Coating: Ruthenium-based ternary mixed metal oxide coating

Titanium Anode for PCB Copperizing:

PCB plating horizontal plating vertical plating insoluble coating titanium anode auxiliary anode

PCB plating horizontal plating vertical plating insoluble coating titanium anode auxiliary anode titanium anode plate for plating

In the traditional acid copper plating bath of PCB printed circuit boards, the copper balls in the anode basket continuously dissolve into Cu2 to compensate for the loss of Cu2 deposition in the plating solution and keep the concentration of Cu2 in the plating solution constant. But it is different in pulse plating, it has its own characteristics and requirements. Due to the disadvantages in the use of traditional soluble anodes, more and more insoluble anodes are now used instead.

  1. Insoluble coating titanium anode for horizontal pulse electroplating

The insoluble anodes of the horizontal pulse plating line are installed horizontally. Each anode is connected directly to the switch of the pulse power supply with a cable, respectively, to ensure that all anodes at the anode have the same pulse current waveform and are synchronized. The anode generally uses an insoluble titanium coating anode:

  • Base material: industrial pure titanium TA1
  • Coating: Ruthenium-based ternary mixed metal oxide coating
  • shape: multi-purpose mesh, pipe mesh, etc.
  1. Insoluble coating titanium anode for vertical pulse electroplating

For vertical plating systems using insoluble anodes, the plating bath must be standard installed for high-thickness-diameter products. Such as adequate particle stirring and effective filtration. The difference between it and the standard electroplating tank is that the anode is replaced with an insoluble coated titanium anode, and a copper regeneration system is added in the electrolytic cycle, and an insulation film is installed between the anode and the cathode.

In this system, there is generally a problem of increasing Cu2. A simple copper ball regeneration column can be used to avoid this problem by adjusting the Cu2 content. The copper ball regeneration column contains a small copper ball and a diaphragm insoluble titanium anode. The DC potential is changed, so that a high concentration of Cu2 from the aqueduct is partially deposited on the small copper ball, and the plating solution with a lower Cu2 content returns to the electrolytic cell, thereby avoiding Cu2 increase in the electrolytic cell.

PCB plating horizontal plating vertical plating insoluble coating titanium anode auxiliary anode titanium anode plate for plating

The insoluble coating titanium anodizing effect used in the electroplating is better than that of the horizontal type. Under a certain thickness-to-diameter ratio, the effective dispersion rate of the electroplating can generally reach 90% -95%.

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